Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804440 | Chip module with robust in-package interconnects | Saquib B. Halim, Frank Kuechenmeister, Christian Goetze | 2023-10-31 |
| 8957524 | Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure | Dirk Breuer, Frank Kuechenmeister, Jens Paul | 2015-02-17 |
| 8410595 | Semiconductor device with chip mounted on a substrate | Steffen Kroehnert, Kerstin Nocke, Juergen Grafe | 2013-04-02 |