Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804440 | Chip module with robust in-package interconnects | Saquib B. Halim, Frank Kuechenmeister, Kashi Vishwanath Machani | 2023-10-31 |
| 11423612 | Correcting segmented surfaces to align with a rendering of volumetric data | Falko Loeffler, Thomas Ruth, Michael C Wussow | 2022-08-23 |
| 10580745 | Wafer level packaging with integrated antenna structures | Marcel Wieland | 2020-03-03 |
| 10271386 | Induction hob and flexible support for an induction hob | Stephane Lomp, Michael Rupp, Timo Dalaker, Christian Egenter | 2019-04-23 |
| 9884454 | Method for producing an opening in a fiber composite component | Lukas Woerner, Carsten Freymueller | 2018-02-06 |