Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7036216 | Method and apparatus for connecting at least one chip to an external wiring configuration | Christian Hauser, Martin Reiss | 2006-05-02 |
| 7008493 | Method for applying a semiconductor chip to a carrier element | Christian Hauser, Martin Reiss | 2006-03-07 |
| 6894378 | Electronic component with stacked semiconductor chips | — | 2005-05-17 |
| 6891252 | Electronic component with a semiconductor chip and method of producing an electronic component | Martin Neumayer | 2005-05-10 |
| 6664648 | Apparatus for applying a semiconductor chip to a carrier element with a compensating layer | Christian Hauser, Martin Reiss | 2003-12-16 |
| 6614100 | Lead frame for the installation of an integrated circuit in an injection-molded package | Christian Hauser, Helge Schmidt | 2003-09-02 |
| 6534345 | Method for mounting a semiconductor chip on a carrier layer and device for carrying out the method | Simon Muff, Jens Pohl | 2003-03-18 |
| 6525416 | Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them | Christian Hauser, Martin Reiss | 2003-02-25 |
| 6521988 | Device for packaging electronic components | Christian Hauser, Jens Pohl | 2003-02-18 |
| 6486538 | Chip carrier having ventilation channels | Martin Reiss | 2002-11-26 |
| 6430809 | Method for bonding conductors, in particular beam leads | Monika Bauer, Klemens Ferstl, Jens Pohl | 2002-08-13 |
| 6429537 | Semiconductor component with method for manufacturing | Christian Hauser, Martin Neumayer, Achim Neu, Martin Reiss | 2002-08-06 |
| 6364751 | Method for singling semiconductor components and semiconductor component singling device | Jens Pohl, Oliver Wutz | 2002-04-02 |