Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6469086 | Plastic molding compound, composite body, and filler for a plastic molding compound | Alexandra Atzesdorfer, Thies Janczek | 2002-10-22 |
| 6436731 | Method of producing a semiconductor device comprising a cleaning process for removing silicon-containing material | Volker Strutz, Rudiger Uhlmann, Stephan Wege | 2002-08-20 |
| 6429537 | Semiconductor component with method for manufacturing | Christian Hauser, Martin Neumayer, Johann Winderl, Martin Reiss | 2002-08-06 |
| 6400006 | Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component | Thies Janczek | 2002-06-04 |
| 6380616 | Semiconductor component with a number of substrate layers and at least one semiconductor chip, and method of producing the semiconductor component | Gunter Tutsch | 2002-04-30 |
| 6313514 | Pressure sensor component | Jurgen Winterer, Eric Bootz, Bernd Stadler, Thies Janczek | 2001-11-06 |
| 6201467 | Pressure sensor component and production method | Jurgen Winterer, Eric Bootz, Bernd Stadler, Thies Janczek | 2001-03-13 |
| 6036173 | Semiconductor element having a carrying device and a lead frame and a semiconductor chip connected thereto | Thies Janczek, Gunter Tutsch | 2000-03-14 |