TJ

Thies Janczek

Infineon Technologies Ag: 5 patents #1,696 of 7,486Top 25%
SA Siemens Aktiengesellschaft: 3 patents #4,667 of 22,248Top 25%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
📍 Molfsee, DE: #2 of 14 inventorsTop 15%
Overall (All Time): #582,841 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
7516900 Data carrier 2009-04-14
6469086 Plastic molding compound, composite body, and filler for a plastic molding compound Achim Neu, Alexandra Atzesdorfer 2002-10-22
6400006 Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component Achim Neu 2002-06-04
6364205 Chip card having a contact zone and method of producing such a chip card Peter Stampka 2002-04-02
6313514 Pressure sensor component Jurgen Winterer, Eric Bootz, Bernd Stadler, Achim Neu 2001-11-06
6201467 Pressure sensor component and production method Jurgen Winterer, Eric Bootz, Bernd Stadler, Achim Neu 2001-03-13
6186008 Semiconductor sensor component Bernd Stadler, Detlef Houdeau 2001-02-13
6036173 Semiconductor element having a carrying device and a lead frame and a semiconductor chip connected thereto Achim Neu, Gunter Tutsch 2000-03-14
6020627 Chip card and method of manufacturing a chip card Manfred Fries 2000-02-01