GT

Gunter Tutsch

Infineon Technologies Ag: 2 patents #3,160 of 7,486Top 45%
SA Siemens Aktiengesellschaft: 1 patents #10,653 of 22,248Top 50%
📍 Ribnitz-Damgarten, DE: #4 of 18 inventorsTop 25%
Overall (All Time): #1,612,446 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6630727 Modularly expandable multi-layered semiconductor component Thomas Münch 2003-10-07
6380616 Semiconductor component with a number of substrate layers and at least one semiconductor chip, and method of producing the semiconductor component Achim Neu 2002-04-30
6036173 Semiconductor element having a carrying device and a lead frame and a semiconductor chip connected thereto Achim Neu, Thies Janczek 2000-03-14