Issued Patents All Time
Showing 25 most recent of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424201 | Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device | Michael Rogalli, Johann Gatterbauer, Wolfgang Lehnert, Kurt Matoy, Evelyn Napetschnig +1 more | 2022-08-23 |
| 11239188 | Terminal structure of a power semiconductor device | Markus Zundel, Rainer Pelzer | 2022-02-01 |
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Joachim Mahler, Thorsten Meyer +6 more | 2020-08-04 |
| 10648096 | Electrolyte, method of forming a copper layer and method of forming a chip | Werner Robl, Michael Melzl, Bernhard Weidgans, Franziska Haering | 2020-05-12 |
| 10651140 | Semiconductor device with metal structure electrically connected to a conductive structure | Franziska Haering, Hans-Joachim Schulze, Bernhard Weidgans | 2020-05-12 |
| 10373868 | Method of processing a porous conductive structure in connection to an electronic component on a substrate | Martin Mischitz, Markus Heinrici, Michael Roesner, Oliver Hellmund, Caterina Travan +2 more | 2019-08-06 |
| 10340227 | Method for processing a die | Markus Zundel | 2019-07-02 |
| 10090265 | Semiconductor device with metal structure electrically connected to a conductive structure | Franziska Haering, Hans-Joachim Schulze, Bernhard Weidgans | 2018-10-02 |
| 9929111 | Method of manufacturing a layer structure having partially sealed pores | Martin Mischitz, Markus Heinrici, Barbara Eichinger, Stefan Krivec | 2018-03-27 |
| 9911686 | Source down semiconductor devices and methods of formation thereof | Andreas Meiser, Martin Mischitz, Michael Roesner, Michael Pinczolits | 2018-03-06 |
| 9887170 | Multi-layer metal pads | Bernhard Weidgans, Franziska Haering | 2018-02-06 |
| 9780053 | Method of forming a bondpad and bondpad | Magdalena Hoier, Peter Scherl | 2017-10-03 |
| 9666546 | Multi-layer metal pads | Bernhard Weidgans, Franziska Haering | 2017-05-30 |
| 9640419 | Carrier system for processing semiconductor substrates, and methods thereof | Martin Mischitz, Michael Roesner, Michael Pinczolits | 2017-05-02 |
| 9620466 | Method of manufacturing an electronic device having a contact pad with partially sealed pores | Martin Mischitz, Markus Heinrici, Barbara Eichinger, Stefan Krivec | 2017-04-11 |
| 9449876 | Singulation of semiconductor dies with contact metallization by electrical discharge machining | Michael Roesner, Gudrun Stranzl | 2016-09-20 |
| 9368436 | Source down semiconductor devices and methods of formation thereof | Andreas Meiser, Martin Mischitz, Michael Roesner, Michael Pinczolits | 2016-06-14 |
| 9209080 | Semiconductor device comprising a protective structure on a chip backside and method of producing the same | Bernhard Weidgans, Franco Mariani, Alexander Heinrich | 2015-12-08 |
| 9190322 | Method for producing a copper layer on a semiconductor body using a printing process | Martin Mischitz, Markus Heinrici | 2015-11-17 |
| 9006798 | Semiconductor device including trench transistor cell array and manufacturing method | Markus Zundel | 2015-04-14 |
| 8993372 | Method for producing a semiconductor component | Carsten Ahrens, Adolf Koller, Gerald Lackner, Anton Mauder, Hans-Joachim Schulze | 2015-03-31 |
| 8816500 | Semiconductor device having peripheral polymer structures | Ivan Nikitin | 2014-08-26 |
| 8753176 | Device for treating wafers on assembly carriers | Werner Kroeninger | 2014-06-17 |
| 8736054 | Multilayer metallization with stress-reducing interlayer | Jurgen Forster | 2014-05-27 |
| 8735277 | Methods for producing an ultrathin semiconductor circuit | Dirk Mueller, Sokratis Sgouridis | 2014-05-27 |