Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488921 | Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect | Ali Roshanghias, Alfred Binder, Barbara Eichinger, Stefan Karner, Martin Mischitz | 2022-11-01 |
| 11276624 | Semiconductor device power metallization layer with stress-relieving heat sink structure | Michael Nelhiebel, Heiko Assmann, Olaf Heitzsch, Jakob Kriz, Sven Lanzerstorfer +3 more | 2022-03-15 |
| 11239188 | Terminal structure of a power semiconductor device | Markus Zundel, Manfred Schneegans | 2022-02-01 |
| 11127693 | Barrier for power metallization in semiconductor devices | Johann Gatterbauer, Katrin Albers, Joerg Busch, Klaus Goller, Norbert Mais +3 more | 2021-09-21 |
| 11031321 | Semiconductor device having a die pad with a dam-like configuration | Fortunato Lopez, Antonia Maglangit, Siti Amira Faisha Shikh Zakaria | 2021-06-08 |
| 10978395 | Method of manufacturing a semiconductor device having a power metallization structure | Ravi Keshav Joshi, Axel Bürke, Sven Schmidbauer, Michael Nelhiebel | 2021-04-13 |
| 10734320 | Power metallization structure for semiconductor devices | Ravi Keshav Joshi, Axel Buerke, Sven Schmidbauer, Michael Nelhiebel | 2020-08-04 |
| 10700019 | Semiconductor device with compressive interlayer | Marianne Mataln, Michael Nelhiebel, Bernhard Weidgans | 2020-06-30 |
| 10304782 | Compressive interlayer having a defined crack-stop edge extension | Marianne Mataln, Michael Nelhiebel, Bernhard Weidgans | 2019-05-28 |
| 8884407 | Devices for providing an electrical connection | Michael Sternad | 2014-11-11 |