Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040288 | Chip package and method of forming a chip package | Harry Sax, Wolfgang Lehnert, Evelyn Napetschnig, Michael Rogalli | 2024-07-16 |
| 12033972 | Chip package, method of forming a chip package and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Frank Hille +6 more | 2024-07-09 |
| 11735534 | Chip package and method of forming a chip package | Harry Sax, Wolfgang Lehnert, Evelyn Napetschnig, Michael Rogalli | 2023-08-22 |
| 11424201 | Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device | Michael Rogalli, Wolfgang Lehnert, Kurt Matoy, Evelyn Napetschnig, Manfred Schneegans +1 more | 2022-08-23 |
| 11328935 | Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package | Wolfgang Lehnert, Norbert Mais, Verena Muhr, Edmund Riedl, Harry Sax | 2022-05-10 |
| 11127693 | Barrier for power metallization in semiconductor devices | Katrin Albers, Joerg Busch, Klaus Goller, Norbert Mais, Marianne Kolitsch +3 more | 2021-09-21 |
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Frank Hille +6 more | 2021-04-13 |
| 10607972 | Semiconductor devices for integration with light emitting chips and modules thereof | Dietrich Bonart, Bernhard Weidgans, Thomas R. Gross, Martina Heigl | 2020-03-31 |
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Frank Hille +6 more | 2019-10-29 |
| 10049994 | Contact pads with sidewall spacers and method of making contact pads with sidewall spacers | Bernhard Weidgans | 2018-08-14 |
| 9966368 | Semiconductor devices for integration with light emitting chips and modules thereof | Dietrich Bonart, Bernhard Weidgans, Thomas R. Gross, Martina Heigl | 2018-05-08 |
| 9875978 | Semiconductor chip device | Bernhard Weidgans, Dietrich Bonart, Thomas R. Gross, Martina Debie | 2018-01-23 |
| 9704839 | Semiconductor devices for integration with light emitting chips and modules thereof | Dietrich Bonart, Bernhard Weidgans, Thomas R. Gross, Martina Heigl | 2017-07-11 |
| 9502248 | Methods for making a semiconductor chip device | Bernhard Weidgans, Dietrich Bonart, Thomas R. Gross, Martina Debie | 2016-11-22 |
| 9362216 | Conductive pads and methods of formation thereof | Bernhard Weidgans | 2016-06-07 |
| 9082626 | Conductive pads and methods of formation thereof | Bernhard Weidgans | 2015-07-14 |
| 8822327 | Contact pads with sidewall spacers and method of making contact pads with sidewall spacers | Bernhard Weidgans | 2014-09-02 |
| 8765531 | Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement | Bernhard Weidgans, Joerg Busch | 2014-07-01 |
| 8736062 | Pad sidewall spacers and method of making pad sidewall spacers | — | 2014-05-27 |