Issued Patents All Time
Showing 25 most recent of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033972 | Chip package, method of forming a chip package and method of forming an electrical contact | Joachim Mahler, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2024-07-09 |
| 11819944 | Carrier component for a vehicle application, and method for producing a carrier component of this type | Marco Töller, Christian Dahmen, Josef Bartzik | 2023-11-21 |
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Joachim Mahler, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2021-04-13 |
| 10672678 | Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package | Heinrich Koerner, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler +1 more | 2020-06-02 |
| 10600690 | Method for handling a product substrate and a bonded substrate system | Georg Meyer-Berg, Claus von Waechter, Holger Doepke, Dominic Maier, Daniel Porwol +1 more | 2020-03-24 |
| 10565023 | Outage detection and compute resource protection in a computer service environment | Sharad Cornejo Altuzar, Pietro Verrecchia, Benjamin Byrnes, Victoria Svidenko, Donald McNamara +2 more | 2020-02-18 |
| 10497587 | Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materials | Rabie Djemour, Stefan Miethaner | 2019-12-03 |
| 10497634 | Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound | Heinrich Koerner, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler +1 more | 2019-12-03 |
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Joachim Mahler, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2019-10-29 |
| 10157083 | Outage detection and compute resource protection in a computer service environment | Sharad Cornejo Altuzar, Pietro Verrecchia, Benjamin Byrnes, Victoria Svidenko, Donald McNamara +2 more | 2018-12-18 |
| 10128180 | Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages | Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2018-11-13 |
| 10056295 | Method for handling a product substrate, a bonded substrate system and a temporary adhesive | Georg Meyer-Berg, Claus von Waechter, Holger Doepke, Dominic Maier, Daniel Porwol +1 more | 2018-08-21 |
| 9941181 | Chip package and method of forming a chip package | Heinrich Koerner, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler +1 more | 2018-04-10 |
| 9881909 | Method for attaching a semiconductor die to a carrier | Ludwig Heitzer, Christian Stuempfl | 2018-01-30 |
| 9859198 | Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages | Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2018-01-02 |
| 9633927 | Chip arrangement and method for producing a chip arrangement | Joachim Mahler, Alfred Haimerl, Angela Kessler | 2017-04-25 |
| 9576935 | Method for fabricating a semiconductor package and semiconductor package | Ludwig Heitzer, Christian Stuempfl | 2017-02-21 |
| 8906749 | Method for fabricating a semiconductor device | Daniel Porwol, Ulrich Wachter | 2014-12-09 |
| 8669655 | Chip package and a method for manufacturing a chip package | Ottmar Geitner, Walter Hartner, Maciej Wojnowski, Ulrich Wachter, Andreas Stueckjuergen | 2014-03-11 |
| 8659135 | Semiconductor device stack and method for its production | Ulrich Bachmaier, Robert-Christian Hagen, Jens Pohl, Rainer Steiner, Hermann Vllsmeler +2 more | 2014-02-25 |
| 8580070 | Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer | Edward Fuergut, Hermann Vilsmeier, Simon Jerebic | 2013-11-12 |
| 8574966 | Semiconductor device having a semiconductor chip, and method for the production thereof | Edward Fuergut | 2013-11-05 |
| 8519547 | Chip arrangement and method for producing a chip arrangement | Joachim Mahler, Alfred Haimerl, Angela Kessler | 2013-08-27 |
| 8507080 | Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material | Joachim Mahler, Alfred Haimerl, Wolfgang Schober, Angela Kessler | 2013-08-13 |
| 8440733 | Semiconductor component and production method | Joachim Mahler, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2013-05-14 |