Issued Patents All Time
Showing 51–75 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7768107 | Semiconductor component including semiconductor chip and method for producing the same | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2010-08-03 |
| 7749797 | Semiconductor device having a sensor chip, and method for producing the same | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2010-07-06 |
| 7749864 | Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip | Ludwig Heitzer, Jens Pohl, Peter Strobel, Christian Stuempfl | 2010-07-06 |
| 7728053 | Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2010-06-01 |
| 7714422 | Electronic module with a semiconductor chip and a component housing and methods for producing the same | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2010-05-11 |
| 7713791 | Panel and semiconductor device having a composite plate with semiconductor chips | Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Hermann Vilsmeier | 2010-05-11 |
| 7714416 | Electronic circuit in a package-in-package configuration and production method | Ludwig Heitzer, Christian Stuempfl | 2010-05-11 |
| 7709936 | Module with carrier element | Stephan Stoeckl | 2010-05-04 |
| 7709379 | Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof | Thomas Bemmerl, Markus Fink, Edward Fuergut, Horst Groeninger, Hermann Vilsmeier | 2010-05-04 |
| 7705436 | Semiconductor device with semiconductor chip and method for producing it | Joachim Mahler, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2010-04-27 |
| 7692283 | Device including a housing for a semiconductor chip including leads extending into the housing | Holger Woerner, Simon Jerebic | 2010-04-06 |
| 7683460 | Module with a shielding and/or heat dissipating element | Ludwig Heitzer, Christian Stumpfl | 2010-03-23 |
| 7675146 | Semiconductor device with leadframe including a diffusion barrier | Reimund Engl | 2010-03-09 |
| 7666777 | Electronic structure with components connected by way of solderable connecting elements and method | Markus Brunnbauer, Irmgard Escher-Poeppel, Jens Pohl, Christian Stuempfl | 2010-02-23 |
| 7662664 | Electronic circuit in a package-on-package configuration and method for producing the same | Ludwig Heitzer, Jens Pohl, Peter Strobel, Christian Stuempfl | 2010-02-16 |
| 7663218 | Integrated circuit component with a surface-mount housing | Edward Fuergut, Simon Jerebic, Hermann Vilsmeier | 2010-02-16 |
| 7656018 | Package for an electronic component and method for its production | Jens Pohl | 2010-02-02 |
| 7645642 | Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2010-01-12 |
| 7638418 | Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same | Rainer Steiner, Holger Woerner | 2009-12-29 |
| 7629660 | Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2009-12-08 |
| 7619304 | Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof | Kai Chong Chan | 2009-11-17 |
| 7612457 | Semiconductor device including a stress buffer | Joachim Mahler, Alfred Haimerl, Angela Wieneke Kessler | 2009-11-03 |
| 7602614 | Electronic module and method for the production thereof | Wolfram Eurskens, Rudolf Kerler, Heinz Pape, Peter Strobel, Stephan Stoeckl | 2009-10-13 |
| 7592236 | Method for applying a structure of joining material to the back surfaces of semiconductor chips | Ludwig Heitzer, Jens Pohl, Peter Strobel, Christian Stuempfl | 2009-09-22 |
| 7589403 | Lead structure for a semiconductor component and method for producing the same | Angela Kessler, Wolfgang Schober, Alfred Haimerl, Joachim Mahler | 2009-09-15 |