Issued Patents All Time
Showing 76–94 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7566968 | Biosensor with smart card configuration | Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Holger Woerner | 2009-07-28 |
| 7554196 | Plastic package and semiconductor component comprising such a plastic package, and method for its production | Ulrich Bachmaier, Robert-Christian Hagen | 2009-06-30 |
| 7547645 | Method for coating a structure comprising semiconductor chips | Ludwig Heitzer, Jens Pohl, Peter Strobel, Christian Stuempfl | 2009-06-16 |
| 7545047 | Semiconductor device with a wiring substrate and method for producing the same | Edward Fuergut, Simon Jerebic, Holger Woerner | 2009-06-09 |
| 7535111 | Semiconductor component with semiconductor chip and adhesive film, and method for its production | Kai Chong Chan | 2009-05-19 |
| 7482198 | Method for producing through-contacts and a semiconductor component with through-contacts | Edward Fuergut, Simon Jerebic, Holger Woerner | 2009-01-27 |
| 7470601 | Semiconductor device with semiconductor chip and adhesive film and method for producing the same | Ludwig Heitzer, Eric Kuerzel, Peter Strobel | 2008-12-30 |
| 7464603 | Sensor component with a cavity housing and a sensor chip and method for producing the same | Angela Kessler, Wolfgang Schober, Alfred Haimerl, Joachim Mahler | 2008-12-16 |
| 7462940 | Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2008-12-09 |
| 7443019 | Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2008-10-28 |
| 7420262 | Electronic component and semiconductor wafer, and method for producing the same | Peter Strobel, Gerald Ofner, Edward Fürgut, Simon Jerebic, Thomas Bemmerl +2 more | 2008-09-02 |
| 7408241 | Semiconductor device with a recessed bond pad | Irmgard Escher-Poeppel, Edward Fuergut, Simon Jerebic, Holger Woerner | 2008-08-05 |
| 7327023 | Semiconductor component with plastic housing, and process for producing the same | Ulrich Bachmaier, Robert-Christian Hagen, Jens Pohl, Rainer Steiner, Peter Strobel +3 more | 2008-02-05 |
| 7294916 | Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip | Ludwig Heitzer, Jens Pohl, Peter Strobel, Christian Stuempfl | 2007-11-13 |
| 7276785 | Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof | Wolfram Eurskens, Gerold Gruendler, Rudolf Kerler, Heinz Pape, Peter Strobel | 2007-10-02 |
| 7230309 | Semiconductor component and sensor component for data transmission devices | Thomas Engling, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2007-06-12 |
| 7009288 | Semiconductor component with electromagnetic shielding device | Christian Birzer, Georg Ernst, Rainer Steiner, Hermann Vilsmeier, Holger Woerner | 2006-03-07 |
| 6940156 | Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module | Christian Birzer, Gerald Ofner, Stephan Stoeckl | 2005-09-06 |
| 6906392 | Micromechanical component | Hubert Benzel, Heribert Weber, Hans Artmann, Thorsten Pannek, Frank Schaefer +1 more | 2005-06-14 |