Issued Patents All Time
Showing 26–50 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8354299 | Semiconductor component having a stack of semiconductor chips and method for producing the same | Thomas Engling, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2013-01-15 |
| 8350382 | Semiconductor device including electronic component coupled to a backside of a chip | Edward Fürgut, Joachim Mahler | 2013-01-08 |
| 8330260 | Electronic component of VQFN design and method for producing the same | Ludwig Heitzer, Christian Stuempfl | 2012-12-11 |
| 8178390 | Semiconductor component and production method | Joachim Mahler, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2012-05-15 |
| 8173488 | Electronic device and method of manufacturing same | Ludwig Heitzer, Daniel Porwol | 2012-05-08 |
| 8168472 | Semiconductor device having a semiconductor chip, and method for the production thereof | Edward Fuergut | 2012-05-01 |
| 8129831 | Chip arrangement and method for producing a chip arrangement | Joachim Mahler, Alfred Haimerl | 2012-03-06 |
| 8062928 | Semiconductor device having a semiconductor chip, and method for the production thereof | Edward Fuergut | 2011-11-22 |
| 8017438 | Semiconductor module with at least two substrates | Angela Kessler, Wolfgang Schober, Alfred Haimerl, Joachim Mahler | 2011-09-13 |
| 8011495 | Transfer device metering apparatus and methods | Vernon J. Anderson, Gene Allen Corle, Christopher T. Davis, Simin Jiang, Irvan Leo Pazdernik +1 more | 2011-09-06 |
| 8013441 | Power semiconductor device in lead frame employing connecting element with conductive film | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2011-09-06 |
| 7993969 | Method for producing a module with components stacked one above another | Jens Pohl | 2011-08-09 |
| 7944061 | Semiconductor device having through contacts through a plastic housing composition and method for the production thereof | Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Christian Stuempfl, Horst Theuss +1 more | 2011-05-17 |
| 7935622 | Support with solder ball elements and a method for populating substrates with solder balls | Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Herman Vilsmeier | 2011-05-03 |
| 7919857 | Plastic housing and semiconductor component with said plastic housing | Peter Strobel, Jens Pohl, Christian Stuempfl, Ludwig Heitzer | 2011-04-05 |
| 7911039 | Component arrangement comprising a carrier | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2011-03-22 |
| 7893532 | External contact material for external contacts of a semiconductor device and method of making the same | Irmgard Escher-Poeppel, Edward Fuergut, Simon Jerebic, Bernd Rakow, Peter Strobel +1 more | 2011-02-22 |
| 7880300 | Semiconductor chip comprising a metal coating structure and associated production method | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2011-02-01 |
| 7843055 | Semiconductor device having an adhesion promoting layer and method for producing it | Markus Brunnbauer, Edward Fuergut, Joachim Mahler | 2010-11-30 |
| 7834467 | Layer between interfaces of different components in semiconductor devices | Alfred Haimerl, Khalil Hosseini, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2010-11-16 |
| 7834460 | Method for manufacturing an electronic component and corresponding electronic component | Ludwig Heitzer, Christian Stuempfl | 2010-11-16 |
| 7800241 | Semiconductor device with semiconductor device components embedded in a plastics composition | Thomas Bemmerl, Edward Fuergut | 2010-09-21 |
| 7795742 | Semiconductor device having a semiconductor chip, and method for the production thereof | Edward Fuergut | 2010-09-14 |
| 7795727 | Semiconductor module having discrete components and method for producing the same | Alfred Haimerl, Angela Kessler, Joachim Mahler | 2010-09-14 |
| 7772105 | Semiconductor component with plastic housing, and process for producing the same | Ulrich Bachmaier, Robert-Christian Hagen, Jens Pohl, Rainer Steiner, Peter Strobel +3 more | 2010-08-10 |