Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393742 | Method for fabricating a semiconductor flip-chip package | Thorsten Meyer, Irmgard Escher-Poeppel, Klaus Pressel | 2022-07-19 |
| 9683278 | Diffusion solder bonding using solder preforms | Alexander Heinrich | 2017-06-20 |
| 8642408 | Semiconductor device | Ralf Otremba, Joachim Mahler, Reimund Engl, Rupert Fischer | 2014-02-04 |
| 8030741 | Electronic device | Thomas Bemmerl, Thomas Mende | 2011-10-04 |
| 7893532 | External contact material for external contacts of a semiconductor device and method of making the same | Michael Bauer, Irmgard Escher-Poeppel, Edward Fuergut, Simon Jerebic, Peter Strobel +1 more | 2011-02-22 |
| 7868465 | Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier | Ralf Otremba, Joachim Mahler, Reimund Engl, Rupert Fischer | 2011-01-11 |
| 7737537 | Electronic device | Thomas Bemmerl, Thomas Mende | 2010-06-15 |