Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261146 | Semiconductor package | Edward Fuergut, Ralf Otremba, Martin Gruber | 2025-03-25 |
| 11715719 | Semiconductor package and method of forming a semiconductor package | Edward Fuergut, Ralf Otremba, Martin Gruber | 2023-08-01 |
| 11688713 | Additive manufacturing of a frontside or backside interconnect of a semiconductor die | Edward Fuergut, Martin Gruber, Ivan Nikitin, Hans-Joachim Schulze | 2023-06-27 |
| 11531056 | Predictive chip-maintenance | Thorsten Meyer, Gerhard Poeppel | 2022-12-20 |
| 11393742 | Method for fabricating a semiconductor flip-chip package | Thorsten Meyer, Klaus Pressel, Bernd Rakow | 2022-07-19 |
| 10957671 | Method for fabricating a semiconductor and semiconductor package | Gottfried Beer | 2021-03-23 |
| 10886186 | Semiconductor package system | Thorsten Scharf, Ralf Otremba, Thomas Bemmerl, Martin Gruber, Michael Juerss +2 more | 2021-01-05 |
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Khalil Hosseini, Johannes Lodermeyer, Joachim Mahler, Thorsten Meyer, Georg Meyer-Berg +6 more | 2020-08-04 |
| 10643971 | Method for fabricating a semiconductor and semiconductor package | Gottfried Beer | 2020-05-05 |
| 10573533 | Method of reducing a sheet resistance in an electronic device, and an electronic device | Edward Fuergut, Stephanie Fassl, Paul Ganitzer, Gerhard Poeppel, Werner Schustereder +1 more | 2020-02-25 |
| 10438926 | Method for fabricating a semiconductor and semiconductor package | Gottfried Beer | 2019-10-08 |
| 10096584 | Method for producing a power semiconductor module | Olaf Hohlfeld, Guido Boenig, Edward Fuergut, Martin Gruber, Thorsten Meyer | 2018-10-09 |
| 10014275 | Method for producing a chip assemblage | Alexander Heinrich, Martin Gruber, Andreas Munding, Catharina Wille | 2018-07-03 |
| 9818730 | Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement | Gottfried Beer, Juergen Hoegerl, Olaf Hohlfeld, Peter Kanschat | 2017-11-14 |
| 9768037 | Electronic device package including metal blocks | Petteri Palm, Edward Fuergut | 2017-09-19 |
| 9620459 | Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement | Gottfried Beer, Juergen Hoegerl, Olaf Hohlfeld, Peter Kanschat | 2017-04-11 |
| 9584889 | System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille | Edward Fuergut, Alfons Dehe | 2017-02-28 |
| 9536953 | Method for making a sensor device using a graphene layer | Klaus Elian, Guenther Ruhl, Horst Theuss | 2017-01-03 |
| 9355984 | Electronic device and method for fabricating an electronic device | Eduard Knauer, Thomas Kunstmann, Peter Scherl, Raimund Foerg | 2016-05-31 |
| 9287206 | Method of fabricating a semiconductor device with encapsulant | Gottfried Beer | 2016-03-15 |
| 9275916 | Removable indicator structure in electronic chips of a common substrate for process adjustment | Edward Fuergut, Manfred Engelhardt, Hans-Joerg Timme, Hannes Eder | 2016-03-01 |
| 9230894 | Methods for manufacturing a chip package | Edward Fuergut | 2016-01-05 |
| 9129959 | Method for manufacturing an electronic module and an electronic module | Edward Fuergut, Gottfried Beer | 2015-09-08 |
| 9070615 | Method for making a sensor device using a graphene layer | Klaus Elian, Guenther Ruhl, Horst Theuss | 2015-06-30 |
| 8829663 | Stackable semiconductor package with encapsulant and electrically conductive feed-through | Jens Pohl, Markus Brunnbauer, Thorsten Meyer | 2014-09-09 |