Issued Patents All Time
Showing 1–25 of 203 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033972 | Chip package, method of forming a chip package and method of forming an electrical contact | Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2024-07-09 |
| 11682644 | Semiconductor device with a heterogeneous solder joint and method for fabricating the same | Swee Kah Lee, Sook Woon Chan, Fong Mei Lum, Muhammad Muhammat Sanusi | 2023-06-20 |
| 11296015 | Die attach methods and semiconductor devices manufactured based on such methods | Giovanni Ragasa Garbin, Chen Wen Lee, Benjamin Reichert, Peter Strobel | 2022-04-05 |
| 11189537 | Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit | Khalil Hosseini, Edward Fuergut | 2021-11-30 |
| 11081417 | Manufacturing a package using plateable encapsulant | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2021-08-03 |
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2021-04-13 |
| 10854547 | Chip package with cross-linked thermoplastic dielectric | Georg Meyer-Berg, Guenter Tutsch | 2020-12-01 |
| 10832992 | Die attach methods and semiconductor devices manufactured based on such methods | Giovanni Ragasa Garbin, Chen Wen Lee, Benjamin Reichert, Peter Strobel | 2020-11-10 |
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Thorsten Meyer, Georg Meyer-Berg +6 more | 2020-08-04 |
| 10670474 | Temperature sensor | Christian Kegler, Johannes Georg Laven, Hans-Joachim Schulze, Guenther Ruhl | 2020-06-02 |
| 10672678 | Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package | Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert +1 more | 2020-06-02 |
| 10497634 | Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound | Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert +1 more | 2019-12-03 |
| 10497694 | Power semiconductor devices and a method for forming a power semiconductor device | Guenther Kolmeder | 2019-12-03 |
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2019-10-29 |
| 10403556 | Semiconductor device including a heat sink structure | Johannes Georg Laven, Peter Irsigler, Guenther Ruhl, Hans-Joachim Schulze, Markus Zundel | 2019-09-03 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2019-08-27 |
| 10396015 | Die attach methods and semiconductor devices manufactured based on such methods | Benjamin Reichert, Chen Wen Lee, Giovanni Ragasa Garbin, Peter Strobel | 2019-08-27 |
| 10297564 | Semiconductor die attach system and method | Georg Meyer-Berg | 2019-05-21 |
| 10177112 | Attaching chip attach medium to already encapsulated electronic chip | Edward Fuergut, Georg Meyer-Berg | 2019-01-08 |
| 10121690 | Method of manufacturing a semiconductor component and semiconductor component | Georg Meyer-Berg, Edward Fuergut | 2018-11-06 |
| 10049962 | Arrangement of multiple power semiconductor chips and method of manufacturing the same | Georg Meyer-Berg, Edward Fuergut | 2018-08-14 |
| 10038105 | Semiconductor devices, a semiconductor diode and a method for forming a semiconductor device | Thomas Basler, Hans-Joachim Schulze | 2018-07-31 |
| 10020245 | Laminate electronic device | Henrik Ewe, Anton Prueckl, Stefan Landau | 2018-07-10 |
| 9988262 | Temporary mechanical stabilization of semiconductor cavities | Dominic Maier, Daniel Porwol, Alfred Sigl | 2018-06-05 |
| 9984897 | Method for manufacturing a chip arrangement including a ceramic layer | Manfred Mengel, Khalil Hosseini, Franz-Peter Kalz | 2018-05-29 |