Issued Patents All Time
Showing 26–50 of 203 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9986636 | Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boards | Ralf Otremba | 2018-05-29 |
| 9953952 | Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier | Michael Juerss, Stefan Landau | 2018-04-24 |
| 9941181 | Chip package and method of forming a chip package | Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert +1 more | 2018-04-10 |
| 9852918 | Embedding additive particles in encapsulant of electronic device | Peh Hean Teh, Jagen Krishnan, Swee Kah Lee, Poh Cheng Lim, Chew Theng Tai +2 more | 2017-12-26 |
| 9825023 | Insulated gate bipolar transistor comprising negative temperature coefficient thermistor | Thomas Basler, Erich Griebl, Daniel Pedone, Wolfgang Scholz, Philipp Seng +2 more | 2017-11-21 |
| 9793255 | Power semiconductor device including a cooling material | Ralf Otremba, Hans-Joachim Schulze, Guenther Ruhl, Hans-Joerg Timme | 2017-10-17 |
| 9790086 | Micromechanical semiconductor sensing device | Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Manfred Mengel | 2017-10-17 |
| 9673170 | Batch process for connecting chips to a carrier | Rupert Fischer, Peter Strobel, Konrad Roesl, Alexander Heinrich | 2017-06-06 |
| 9666452 | Chip packages and methods for manufacturing a chip package | Karl Mayer, Guenter Tutsch, Horst Theuss, Manfred Engelhardt | 2017-05-30 |
| 9666499 | Semiconductor device with encapsulant | Edward Fuergut, Khalil Hosseini, Georg Meyer-Berg | 2017-05-30 |
| 9660029 | Semiconductor device having a positive temperature coefficient structure | Thomas Basler, Hans-Joachim Schulze, Johannes Georg Laven | 2017-05-23 |
| 9648735 | Printed circuit boards and methods of manufacturing thereof | Ralf Otremba | 2017-05-09 |
| 9633927 | Chip arrangement and method for producing a chip arrangement | Alfred Haimerl, Angela Kessler, Michael Bauer | 2017-04-25 |
| 9583413 | Semiconductor device | Ivan Nikitin, Thomas Behrens | 2017-02-28 |
| 9576944 | Semiconductor devices with transistor cells and thermoresistive element | Johannes Georg Laven, Christian Jaeger, Daniel Pedone, Anton Prueckl, Hans-Joachim Schulze +2 more | 2017-02-21 |
| 9567211 | Micromechanical semiconductor sensing device | Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Manfred Mengel | 2017-02-14 |
| 9559078 | Electronic component | Manfred Mengel, Khalil Hosseini, Klaus Schmidt, Franz-Peter Kalz | 2017-01-31 |
| 9540539 | Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device | Swee Kah Lee, Chew Theng Tai, Yik Yee Tan, Soon Lock Goh, Poh Cheng Lim +2 more | 2017-01-10 |
| 9530752 | Method for forming electronic components | Ivan Nikitin, Petteri Palm | 2016-12-27 |
| 9530754 | Chip package and chip assembly | Khalil Hosseini, Franz-Peter Kalz, Joachim Voelter, Ralf Wombacher | 2016-12-27 |
| 9515243 | Temperature sensor | Christian Kegler, Johannes Georg Laven, Hans-Joachim Schulze, Guenther Ruhl | 2016-12-06 |
| 9496228 | Integrated circuit and method of manufacturing an integrated circuit | Edward Fuergut, Ivan Nikitin | 2016-11-15 |
| 9443760 | Multichip power semiconductor device | Thomas Bemmerl, Anton Prueckl | 2016-09-13 |
| 9437548 | Chip package and method for manufacturing the same | Henrik Ewe, Anton Prueckl, Frank Daeche, Josef Hoeglauer, Riccardo Pittassi | 2016-09-06 |
| 9420731 | Electronic power device and method of fabricating an electronic power device | Khalil Hosseini, Ivan Nikitin | 2016-08-16 |