Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854547 | Chip package with cross-linked thermoplastic dielectric | Joachim Mahler, Georg Meyer-Berg | 2020-12-01 |
| 9666452 | Chip packages and methods for manufacturing a chip package | Karl Mayer, Horst Theuss, Manfred Engelhardt, Joachim Mahler | 2017-05-30 |