Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218098 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Thorsten Scharf | 2025-02-04 |
| 11309277 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Thorsten Scharf | 2022-04-19 |
| 10734351 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Thorsten Scharf | 2020-08-04 |
| 10056348 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Thorsten Scharf | 2018-08-21 |
| 9530754 | Chip package and chip assembly | Khalil Hosseini, Joachim Mahler, Franz-Peter Kalz, Joachim Voelter | 2016-12-27 |
| 9379033 | Sensor package | Horst Theuss | 2016-06-28 |
| 9159701 | Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assembly | Khalil Hosseini, Joachim Mahler, Franz-Peter Kalz, Joachim Voelter | 2015-10-13 |
| 9123708 | Semiconductor chip package | Khalil Hosseini, Thomas Wowra, Joachim Mahler | 2015-09-01 |
| 8980687 | Semiconductor device and method of manufacturing thereof | Ivan Nikitin, Stefan Landau, Joachim Mahler, Alexander Heinrich | 2015-03-17 |
| 8847385 | Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package | Joachim Mahler, Anton Prueckl | 2014-09-30 |
| 8674462 | Sensor package | Horst Theuss | 2014-03-18 |
| 7847375 | Electronic device and method of manufacturing same | Joachim Mahler, Ralf Otremba | 2010-12-07 |
| 7705472 | Semiconductor device with semiconductor device components embedded in a plastic housing composition | Joachim Mahler, Dieter Lachman, Bernd Betz, Stefan Paulus, Edmund Riedl | 2010-04-27 |
| 7645636 | Semiconductor device and method for producing it, and use of an electrospinning method | — | 2010-01-12 |