Issued Patents All Time
Showing 1–25 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347805 | Inkjet printing of diffusion solder | Stefan Schwab, Catharina Wille | 2025-07-01 |
| 12330243 | Method of forming an intermetallic phase layer with a plurality of nickel particles | Alexander Roth, Catharina Wille | 2025-06-17 |
| 12261144 | Semiconductor device and method for fabricating a semiconductor device | — | 2025-03-25 |
| 12255168 | Electronic device with multi-layer contact and system | Michael Juerss, Konrad Roesl, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2025-03-18 |
| 12205870 | Semiconductor package and method for fabricating a semiconductor package | Ralf Otremba, Paul Frank, Alexandra Ludsteck-Pechloff, Daniel Pedone | 2025-01-21 |
| 12166005 | Semiconductor device having a soldered joint with one or more intermetallic phases | Konrad Roesl, Kirill Trunov, Arthur Unrau | 2024-12-10 |
| 12069802 | Pre-plating of solder layer on solderable elements for diffusion soldering | Alexander Roth | 2024-08-20 |
| 12064606 | Data collection apparatus for attachment to an injection device | Christian Rehbein, Sven Hagebusch, Chris Knorr, Maurice Toporek, Matthias Felber | 2024-08-20 |
| 12027490 | Semiconductor device and method for fabricating the same | Richard Knipper, Thorsten Scharf, Stefan Schwab | 2024-07-02 |
| 12023762 | Layer structure with an intermetallic phase layer and a chip package that includes the layer structure | Alexander Roth, Catharina Wille | 2024-07-02 |
| 11944796 | Data collection apparatus for attachment to an injection device | Maurice Toporek, Matthias Felber, Christoph Matthias Gugl, Marcus-Meinolf Dittrich, Christian Nessel +5 more | 2024-04-02 |
| 11865313 | Data collection apparatus for attachment to an injection device | Christian Rehbein, Sven Hagebusch, Chris Knorr, Maurice Toporek, Matthias Felber | 2024-01-09 |
| 11862600 | Method of forming a chip package and chip package | Thorsten Scharf, Steffen Jordan | 2024-01-02 |
| 11842975 | Electronic device with multi-layer contact and system | Michael Juerss, Konrad Roesl, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2023-12-12 |
| 11817417 | Semiconductor device and method for fabricating a semiconductor device | — | 2023-11-14 |
| 11776927 | Semiconductor device including a solder compound containing a compound Sn/Sb | Thomas Behrens, Evelyn Napetschnig, Bernhard Weidgans, Catharina Wille, Christina Yeong | 2023-10-03 |
| 11730891 | Data collection apparatus for attachment to an injection device | Maurice Toporek, Matthias Felber, Christoph Matthias Gugl, Marcus-Meinolf Dittrich, Christian Nessel +5 more | 2023-08-22 |
| 11688670 | Semiconductor package and method for fabricating a semiconductor package | Ralf Otremba, Paul Frank, Alexandra Ludsteck-Pechloff, Daniel Pedone | 2023-06-27 |
| 11652084 | Flat lead package formation method | Thorsten Meyer, Gerald Ofner, Stephan Bradl, Stefan Miethaner, Horst Theuss +1 more | 2023-05-16 |
| 11605608 | Preform diffusion soldering | Konrad Roesl, Kirill Trunov, Arthur Unrau | 2023-03-14 |
| 11584200 | Arrangement for operating one or more windows installed in a vehicle | Annette Hebling | 2023-02-21 |
| 11552042 | Solder material with two different size nickel particles | Alexander Roth, Catharina Wille | 2023-01-10 |
| 11547806 | Data collection apparatus for attachment to an injection device | Christian Rehbein, Sven Hagebusch, Chris Knorr, Maurice Toporek, Matthias Felber | 2023-01-10 |
| 11518341 | Method for controlling a locking element of a vehicle | — | 2022-12-06 |
| 11511047 | Data collection apparatus for attachment to an injection device | Maurice Toporek, Matthias Felber, Christoph Matthias Gugl, Marcus-Meinolf Dittrich, Christian Nessel +5 more | 2022-11-29 |