Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347805 | Inkjet printing of diffusion solder | Alexander Heinrich, Catharina Wille | 2025-07-01 |
| 12288727 | Method of manufacturing a package having an adhesion promoter | Edmund Riedl, Steffen Jordan, Stefan Miethaner | 2025-04-29 |
| 12152133 | Mold compounds and packages for encapsulating electronic components | Andreas Waterloo | 2024-11-26 |
| 12136578 | Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevations | Edmund Riedl | 2024-11-05 |
| 12027490 | Semiconductor device and method for fabricating the same | Richard Knipper, Alexander Heinrich, Thorsten Scharf | 2024-07-02 |
| 11652012 | Inorganic encapsulant for electronic component with adhesion promoter | Edmund Riedl, Steffen Jordan, Stefan Miethaner | 2023-05-16 |
| 11486407 | Method for controlling at least two fans | Andreas Fessel, Walter Eberle | 2022-11-01 |
| 11424217 | Soldering a conductor to an aluminum layer | Alexander Heinrich, Ralf Otremba | 2022-08-23 |
| 11404359 | Leadframe package with isolation layer | Alexander Roth | 2022-08-02 |
| 10910284 | Semiconductor device and method of manufacturing thereof | Herbert Hutter | 2021-02-02 |
| 9844134 | Device including a metallization layer and method of manufacturing a device | Martin Mischitz, Markus Heinrici | 2017-12-12 |
| 9818602 | Method of depositing a resin material on a semiconductor body with an inkjet process | Markus Heinrici, Rafael Janski, Susanne Kraeuter, Martin Mischitz | 2017-11-14 |