Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288727 | Method of manufacturing a package having an adhesion promoter | Edmund Riedl, Steffen Jordan, Stefan Schwab | 2025-04-29 |
| 11652084 | Flat lead package formation method | Thorsten Meyer, Gerald Ofner, Stephan Bradl, Alexander Heinrich, Horst Theuss +1 more | 2023-05-16 |
| 11652012 | Inorganic encapsulant for electronic component with adhesion promoter | Edmund Riedl, Steffen Jordan, Stefan Schwab | 2023-05-16 |
| 11302668 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Gerald Ofner, Stephan Bradl, Alexander Heinrich, Horst Theuss +1 more | 2022-04-12 |
| 11069626 | Molding compound and semiconductor package with a molding compound | Anton Mauder, Oliver Hellmund, Peter Irsigler, Hanno Melzner, Sebastian Schmidt +1 more | 2021-07-20 |
| 10566309 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Gerald Ofner, Peter Scherl, Stephan Bradl, Alexander Heinrich +1 more | 2020-02-18 |
| 10497587 | Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materials | Rabie Djemour, Michael Bauer | 2019-12-03 |
| 7408803 | Method for writing to magnetoresistive memory cells and magnetoresistive memory which can be written to by the method | Martin Freitag, Wolfgang Raberg | 2008-08-05 |
| 6943393 | Memory cell arrangement and method of fabricating it | Siegfried Schwarzl, Annette Saenger | 2005-09-13 |
| 6574138 | Memory cell configuration and method for operating the configuration | Siegfried Schwarzl | 2003-06-03 |
| 6458603 | Method of fabricating a micro-technical structure, and micro-technical component | Alfred Kersch, Siegfried Schwarzl, Hermann Wendt | 2002-10-01 |