Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288727 | Method of manufacturing a package having an adhesion promoter | Edmund Riedl, Stefan Miethaner, Stefan Schwab | 2025-04-29 |
| 11862600 | Method of forming a chip package and chip package | Thorsten Scharf, Alexander Heinrich | 2024-01-02 |
| 11652012 | Inorganic encapsulant for electronic component with adhesion promoter | Edmund Riedl, Stefan Miethaner, Stefan Schwab | 2023-05-16 |
| 10366924 | Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance | Thorsten Scharf | 2019-07-30 |
| 10229885 | Method of galvanic plating assisted by a current distribution layer | Martin Gruber | 2019-03-12 |
| 10229891 | Chip embedding package with solderable electric contact | Thorsten Scharf, Wolfgang Schober, Thomas Ziegler | 2019-03-12 |
| 9074594 | Compressed-air compressor and method of operation | Christoph Wilken | 2015-07-07 |
| 8410586 | Semiconductor package and method of assembling a semiconductor package | Edmund Riedl, Christof Matthias Schilz, Fee Hoon Wendy Wong | 2013-04-02 |
| 8246330 | Integrated catalyst | Dogan Ay, Ingo Stumberg, Herbert Schlensker | 2012-08-21 |
| 7989930 | Semiconductor package | Edmund Riedl, Joachim Mahler, Johannes Lodermeyer, Mathias Vaupel | 2011-08-02 |