Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027490 | Semiconductor device and method for fabricating the same | Alexander Heinrich, Thorsten Scharf, Stefan Schwab | 2024-07-02 |
| 11562967 | Method for fabricating a semiconductor package, semiconductor package and embedded PCB module | Frank Daeche | 2023-01-24 |
| 11004700 | Temporary post-assisted embedding of semiconductor dies | Thorsten Scharf | 2021-05-11 |