Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996771 | Power semiconductor system having an inductor module attached to a power stage module | Petteri Palm, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2024-05-28 |
| 11903132 | Power electronic assembly having a laminate inlay and method of producing the power electronic assembly | Petteri Palm, Martin Benisek, Liu Chen, Josef Maerz | 2024-02-13 |
| 11699640 | Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production | Thomas Stoek, Chee Voon Tan | 2023-07-11 |
| 11632860 | Power electronic assembly and method of producing thereof | Petteri Palm, Martin Benisek, Liu Chen, Josef Maerz | 2023-04-18 |
| 11562967 | Method for fabricating a semiconductor package, semiconductor package and embedded PCB module | Richard Knipper | 2023-01-24 |
| 11539291 | Method of manufacturing a power semiconductor system | Petteri Palm, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2022-12-27 |
| 11183445 | Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangement | Dirk Ahlers, Daniel Schleisser, Thomas Stoek | 2021-11-23 |
| 11004823 | Chip assembly and method of manufacturing thereof | Alexander Heinrich | 2021-05-11 |
| 10833583 | Methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2020-11-10 |
| 10601314 | Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2020-03-24 |
| 10325834 | Semiconductor packages and methods of fabrication thereof | Dirk Meinhold, Thorsten Scharf | 2019-06-18 |
| 10186481 | Semiconductor device including a passive component formed in a redistribution layer | Maciej Wojnowski, Zeeshan Umar | 2019-01-22 |
| 9773719 | Semiconductor packages and methods of fabrication thereof | Dirk Meinhold, Thorsten Scharf | 2017-09-26 |
| 9437548 | Chip package and method for manufacturing the same | Henrik Ewe, Anton Prueckl, Joachim Mahler, Josef Hoeglauer, Riccardo Pittassi | 2016-09-06 |
| 9425116 | Integrated circuit package and a method for manufacturing an integrated circuit package | Georg Meyer-Berg | 2016-08-23 |
| 9269685 | Integrated circuit package and packaging methods | Georg Meyer-Berg | 2016-02-23 |
| 9105562 | Integrated circuit package and packaging methods | Georg Meyer-Berg | 2015-08-11 |
| 9059155 | Chip package and method for manufacturing the same | Henrik Ewe, Anton Prueckl, Joachim Mahler, Josef Hoeglauer, Riccardo Pittassi | 2015-06-16 |
| 8686569 | Die arrangement and method of forming a die arrangement | Joachim Mahler, Anton Prueckl, Stefan Landau, Josef Hoeglauer | 2014-04-01 |
| 7268436 | Electronic device with cavity and a method for producing the same | Robert Aigner, Albert Auburger, Guenter Ehrler, Andreas Meckes, Horst Theuss +1 more | 2007-09-11 |
| 7221048 | Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier | Jochen Dangelmaier, Stefan Paulus, Bernd Stadler, Horst Theuss, Michael Weber | 2007-05-22 |
| 7031170 | Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device | Franz Petter | 2006-04-18 |
| 7011986 | Method for manufacturing a housing for a chip with a micromechanical structure | Hans-Joerg Timme | 2006-03-14 |