Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996771 | Power semiconductor system having an inductor module attached to a power stage module | Petteri Palm, Frank Daeche, Zeeshan Umar, Maciej Wojnowski, Xaver Schloegel +1 more | 2024-05-28 |
| 11539291 | Method of manufacturing a power semiconductor system | Petteri Palm, Frank Daeche, Zeeshan Umar, Maciej Wojnowski, Xaver Schloegel +1 more | 2022-12-27 |
| 10833583 | Methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Frank Daeche, Zeeshan Umar, Maciej Wojnowski, Xaver Schloegel +1 more | 2020-11-10 |
| 10601314 | Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Frank Daeche, Zeeshan Umar, Maciej Wojnowski, Xaver Schloegel +1 more | 2020-03-24 |
| 10103076 | Semiconductor package including a semiconductor die having redistributed pads | Mark Pavier, Martin Standing | 2018-10-16 |
| 9852940 | Method for forming a reliable solderable contact | Martin Standing, Matthew P. Elwin, David Paul Jones, Martin Carroll, Ian Glenville Wagstaffe | 2017-12-26 |
| 9852939 | Solderable contact and passivation for semiconductor dies | Martin Standing, Matthew P. Elwin, David Paul Jones, Martin Carroll, Ian Glenville Wagstaffe | 2017-12-26 |
| 9673109 | Method for fabricating a semiconductor package with conductive carrier integrated heat spreader | Eung San Cho, Mark Pavier, Daniel Cutler | 2017-06-06 |
| 9633951 | Semiconductor package including a semiconductor die having redistributed pads | Mark Pavier, Martin Standing | 2017-04-25 |
| 9601418 | Stacked half-bridge package | Eung San Cho, Chuan Cheah | 2017-03-21 |
| 9583477 | Stacked half-bridge package | Eung San Cho, Chuan Cheah | 2017-02-28 |
| 9576887 | Semiconductor package including conductive carrier coupled power switches | Eung San Cho, Mark Pavier, Daniel Cutler | 2017-02-21 |
| 9502395 | Power semiconductor package having vertically stacked driver IC | Eung San Cho, Mark Pavier, Daniel Cutler | 2016-11-22 |
| 9461022 | Power semiconductor package with a common conductive clip | Eung San Cho, Chuan Cheah | 2016-10-04 |
| 9397212 | Power converter package including top-drain configured power FET | Eung San Cho, Mark Pavier, Daniel Cutler | 2016-07-19 |
| 9349677 | Stacked half-bridge package with a common leadframe | Eung San Cho, Chuan Cheah | 2016-05-24 |
| 9299690 | Method for fabricating a power semiconductor package including vertically stacked driver IC | Eung San Cho, Mark Pavier, Daniel Cutler | 2016-03-29 |
| 9269655 | Method for fabricating a semiconductor package with conductive carrier integrated heat spreader | Eung San Cho, Mark Pavier, Daniel Cutler | 2016-02-23 |
| 9159703 | Power converter package including vertically stacked driver IC | Eung San Cho, Mark Pavier, Daniel Cutler | 2015-10-13 |
| 9111921 | Semiconductor package with conductive carrier integrated heat spreader | Eung San Cho, Mark Pavier, Daniel Cutler | 2015-08-18 |
| 9048230 | Half-bridge package with a conductive clip | Eung San Cho, Chuan Cheah | 2015-06-02 |
| 8860194 | Buck converter power package | Ling Ma, David Paul Jones, Timothy Henson, Niraj Ranjan, Vijay Viswanathan +1 more | 2014-10-14 |
| 8680627 | Stacked half-bridge package with a common conductive clip | Eung San Cho, Chuan Cheah | 2014-03-25 |
| 8674497 | Stacked half-bridge package with a current carrying layer | Eung San Cho, Chuan Cheah | 2014-03-18 |
| 8466546 | Chip-scale package | Andy Farlow, Mark Pavier, George Pearson, Martin Standing | 2013-06-18 |