Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8426952 | Stacked half-bridge package with a common conductive leadframe | Eung San Cho, Chuan Cheah | 2013-04-23 |
| 8368211 | Solderable top metalization and passivation for source mounted package | Martin Standing, Matthew P. Elwin, David Paul Jones, Martin Carroll, Ian Glenville Wagstaffe | 2013-02-05 |
| 8143729 | Autoclave capable chip-scale package | Mark Pavier, Danish Khatri, Daniel Cutler, Susan Johns, Martin Carroll +1 more | 2012-03-27 |
| 8125083 | Protective barrier layer for semiconductor device electrodes | Martin Carroll, David Paul Jones, Martin Standing | 2012-02-28 |
| 7968984 | Universal pad arrangement for surface mounted semiconductor devices | Martin Standing | 2011-06-28 |
| 7417312 | Use of solder paste for heat dissipation | — | 2008-08-26 |
| 7402507 | Semiconductor package fabrication | Martin Standing, Mark Pavier, Robert J. Clarke, Kenneth McCartney | 2008-07-22 |
| 7285866 | Surface mounted package with die bottom spaced from support board | Martin Standing | 2007-10-23 |
| 6930397 | Surface mounted package with die bottom spaced from support board | Martin Standing | 2005-08-16 |