Issued Patents All Time
Showing 25 most recent of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205919 | Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor module | Josef Hoeglauer, Tobias Polster | 2025-01-21 |
| 10692801 | Bond pad and clip configuration for packaged semiconductor device | Eung San Cho, Jobelito Anjao Guanzon | 2020-06-23 |
| 10204873 | Breakable substrate for semiconductor die | Eung San Cho | 2019-02-12 |
| 10083884 | Compact high-voltage semiconductor package | Eung San Cho | 2018-09-25 |
| 9768087 | Compact high-voltage semiconductor package | Eung San Cho | 2017-09-19 |
| 9601418 | Stacked half-bridge package | Eung San Cho, Andrew N. Sawle | 2017-03-21 |
| 9583477 | Stacked half-bridge package | Eung San Cho, Andrew N. Sawle | 2017-02-28 |
| 9520341 | Semiconductor package with conductive clips | Eung San Cho | 2016-12-13 |
| 9461022 | Power semiconductor package with a common conductive clip | Eung San Cho, Andrew N. Sawle | 2016-10-04 |
| 9449899 | Semiconductor package with heat spreader | Michael A. Briere, Kunzhong Hu | 2016-09-20 |
| 9349677 | Stacked half-bridge package with a common leadframe | Eung San Cho, Andrew N. Sawle | 2016-05-24 |
| 9312375 | III-Nitride device with solderable front metal | Michael A. Briere | 2016-04-12 |
| 9142503 | III-nitride rectifier package | Dae Keun Park | 2015-09-22 |
| 9105619 | Semiconductor package with conductive heat spreader | Michael A. Briere, Kunzhong Hu | 2015-08-11 |
| 9048230 | Half-bridge package with a conductive clip | Eung San Cho, Andrew N. Sawle | 2015-06-02 |
| 8987883 | Semiconductor package with multiple conductive clips | Eung San Cho | 2015-03-24 |
| 8896107 | High power semiconductor package with conductive clip | Eung San Cho | 2014-11-25 |
| 8853706 | High voltage cascoded III-nitride rectifier package with stamped leadframe | Dae Keun Park | 2014-10-07 |
| 8853707 | High voltage cascoded III-nitride rectifier package with etched leadframe | Dae Keun Park | 2014-10-07 |
| 8853744 | Power device with solderable front metal | Michael A. Briere | 2014-10-07 |
| 8811030 | Packaging of electronic circuitry | Timothy Alan Phillips, Danny Clavette, EungSan Cho | 2014-08-19 |
| 8791560 | Interdigitated conductive support for GaN semiconductor die | Kunzhong Hu | 2014-07-29 |
| 8790965 | High voltage cascoded III-nitride rectifier package | Dae Keun Park | 2014-07-29 |
| 8786068 | Packaging of electronic circuitry | Timothy Alan Phillips, Danny Clavette, EungSan Cho | 2014-07-22 |
| 8749034 | High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistor | Eung San Cho | 2014-06-10 |