Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205919 | Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor module | Chuan Cheah, Josef Hoeglauer | 2025-01-21 |
| 12094837 | Method of manufacturing semiconductor devices by filling grooves formed in a front side surface of a wafer with a side face protection material | Christian Gruber, Benjamin Bernard, Carsten von Koblinski | 2024-09-17 |
| 11848237 | Composite wafer, semiconductor device and electronic component | Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller +1 more | 2023-12-19 |
| 11605599 | Semiconductor device having a thin semiconductor die | Christian Gruber, Benjamin Bernard, Carsten von Koblinski | 2023-03-14 |
| 11322400 | Roughening of a metallization layer on a semiconductor wafer | Carsten von Koblinski | 2022-05-03 |
| 11302579 | Composite wafer, semiconductor device and electronic component | Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller +1 more | 2022-04-12 |
| 10672664 | Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device | Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller +1 more | 2020-06-02 |