JG

Jobelito Anjao Guanzon

IA Infineon Technologies Austria Ag: 1 patents #668 of 1,126Top 60%
📍 Cuenca, PH: #16 of 27 inventorsTop 60%
Overall (All Time): #2,799,326 of 4,157,543Top 70%
1
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Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10692801 Bond pad and clip configuration for packaged semiconductor device Eung San Cho, Chuan Cheah 2020-06-23