Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852939 | Solderable contact and passivation for semiconductor dies | Martin Standing, Andrew N. Sawle, Matthew P. Elwin, David Paul Jones, Ian Glenville Wagstaffe | 2017-12-26 |
| 9852940 | Method for forming a reliable solderable contact | Martin Standing, Andrew N. Sawle, Matthew P. Elwin, David Paul Jones, Ian Glenville Wagstaffe | 2017-12-26 |
| 8536645 | Trench MOSFET and method for fabricating same | Timothy Henson, Ling Ma, Hugo Burke, David Paul Jones | 2013-09-17 |
| 8368211 | Solderable top metalization and passivation for source mounted package | Martin Standing, Andrew N. Sawle, Matthew P. Elwin, David Paul Jones, Ian Glenville Wagstaffe | 2013-02-05 |
| 8143729 | Autoclave capable chip-scale package | Mark Pavier, Danish Khatri, Daniel Cutler, Andrew N. Sawle, Susan Johns +1 more | 2012-03-27 |
| 8125083 | Protective barrier layer for semiconductor device electrodes | David Paul Jones, Andrew N. Sawle, Martin Standing | 2012-02-28 |
| 4499693 | Method of grinding non-uniform workpieces | James J. Fatula | 1985-02-19 |