| 9673109 |
Method for fabricating a semiconductor package with conductive carrier integrated heat spreader |
Eung San Cho, Andrew N. Sawle, Mark Pavier |
2017-06-06 |
| 9576887 |
Semiconductor package including conductive carrier coupled power switches |
Eung San Cho, Andrew N. Sawle, Mark Pavier |
2017-02-21 |
| 9502395 |
Power semiconductor package having vertically stacked driver IC |
Eung San Cho, Andrew N. Sawle, Mark Pavier |
2016-11-22 |
| 9397212 |
Power converter package including top-drain configured power FET |
Eung San Cho, Andrew N. Sawle, Mark Pavier |
2016-07-19 |
| 9362221 |
Surface mountable power components |
Mark Pavier, Scott Palmer, Clive O'Dell, Rupert Burbidge |
2016-06-07 |
| 9299690 |
Method for fabricating a power semiconductor package including vertically stacked driver IC |
Eung San Cho, Andrew N. Sawle, Mark Pavier |
2016-03-29 |
| 9269655 |
Method for fabricating a semiconductor package with conductive carrier integrated heat spreader |
Eung San Cho, Andrew N. Sawle, Mark Pavier |
2016-02-23 |
| 9159703 |
Power converter package including vertically stacked driver IC |
Eung San Cho, Andrew N. Sawle, Mark Pavier |
2015-10-13 |
| 9111921 |
Semiconductor package with conductive carrier integrated heat spreader |
Eung San Cho, Andrew N. Sawle, Mark Pavier |
2015-08-18 |
| 9012990 |
Surface mountable power components |
Mark Pavier, Scott Palmer, Clive O'Dell, Rupert Burbidge |
2015-04-21 |
| 8143729 |
Autoclave capable chip-scale package |
Mark Pavier, Danish Khatri, Andrew N. Sawle, Susan Johns, Martin Carroll +1 more |
2012-03-27 |
| 5100325 |
Apparatus and method for creating perspective drawings |
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1992-03-31 |
