Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8466546 | Chip-scale package | Andy Farlow, Mark Pavier, Andrew N. Sawle, Martin Standing | 2013-06-18 |
| 7615873 | Solder flow stops for semiconductor die substrates | Mark Steers | 2009-11-10 |
| 7573107 | Power module | Alberto Guerra, Norman Connah, Mark Steers | 2009-08-11 |