Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8466546 | Chip-scale package | Mark Pavier, Andrew N. Sawle, George Pearson, Martin Standing | 2013-06-18 |
| 7923289 | Process for fabricating a semiconductor package | Mark Pavier | 2011-04-12 |