Issued Patents All Time
Showing 25 most recent of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12399153 | Photoacoustic sensors and MEMS devices | Rainer Markus Schaller, Matthias Eberl, Simon Gassner, Franz Jost, Stefan Kolb +1 more | 2025-08-26 |
| 12366615 | Current sensor that includes a current rail and a magnetic field sensor with galvanic isolation | Rainer Markus Schaller, Volker Strutz | 2025-07-22 |
| 12210706 | Ultrasonic touch sensor | Rainer Markus Schaller, Klaus Elian, Horst Theuss | 2025-01-28 |
| 12033972 | Chip package, method of forming a chip package and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2024-07-09 |
| 11851322 | Microelectromechanical system (MEMS) sensor packages and methods for producing microelectromechanical system sensor packages having a plurality of MEMS sensor chips | Rainer Markus Schaller | 2023-12-26 |
| 11835600 | Current sensor | Rainer Markus Schaller, Volker Strutz | 2023-12-05 |
| 11573204 | Photoacoustic sensors and MEMS devices | Rainer Markus Schaller, Matthias Eberl, Simon Gassner, Franz Jost, Stefan Kolb +1 more | 2023-02-07 |
| 11410942 | Package with selective corrosion protection of electric connection structure | Klaus Elian | 2022-08-09 |
| 11239176 | Package comprising identifier on and/or in carrier | Klaus Elian | 2022-02-01 |
| 11073572 | Current sensor device with a routable molded lead frame | Rainer Markus Schaller | 2021-07-27 |
| 11024565 | Direct selective adhesion promotor plating | Kim Huat Hoa, Hazrul Alang Abd Hamid, Andreas Allmeier, Dietmar Lang | 2021-06-01 |
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Joachim Mahler, Michael Bauer, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2021-04-13 |
| 10818805 | Semiconductor sensor device and method for fabricating the same | Franz-Peter Kalz | 2020-10-27 |
| 10781095 | Molded lead frame sensor package | Manfred Schindler, Horst Theuss, Mathias Vaupel | 2020-09-22 |
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2019-10-29 |
| 10297536 | Direct selective adhesion promotor plating | Kim Huat Hoa, Hazrul Alang Abd Hamid, Andreas Allmeier, Dietmar Lang | 2019-05-21 |
| 10107867 | Sensor arrangement, battery cell and energy system | Klaus Elian, Franz Michael Darrer, Thomas Mueller, Mathias Vaupel, Manfred Fries +6 more | 2018-10-23 |
| 9986354 | Pre-mold for a microphone assembly and method of producing the same | Thomas Mueller, Horst Theuss, Stefan Uwe Schindler, Dominik Kohl | 2018-05-29 |
| 9748611 | Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery | Klaus Elian, Manfred Fries, Juergen Hoegerl, Georg Meyer-Berg, Thomas Mueller +3 more | 2017-08-29 |
| 9704786 | Direct selective adhesion promotor plating | Kim Huat Hoa, Hazrul Aland Abd Hamid, Andreas Allmeier, Dietmar Lang | 2017-07-11 |
| 9658296 | Current sensor device | Udo Ausserlechner, Volker Strutz, Rainer Steiner | 2017-05-23 |
| 9059083 | Semiconductor device | Henrik Ewe, Joachim Mahler, Manfred Mengel, Reimund Engl, Josef Hoeglauer | 2015-06-16 |
| 9013013 | Pressure sensor package having a stacked die arrangement | Sebastian Beer, Helmut Wietschorke, Horst Theuss | 2015-04-21 |
| 8872314 | Method for producing a component and device comprising a component | Horst Theuss, Albert Auburger, Josef Hirtreiter | 2014-10-28 |
| 8767983 | Module including a micro-electro-mechanical microphone | Horst Theuss, Jens Krause, Albert Auburger, Bernd Stadler | 2014-07-01 |