Issued Patents All Time
Showing 1–25 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE50485 | Semiconductor module with external power sensor | Leo Aichriedler, Christian Schweikert, Gerald Wriessnegger | 2025-07-08 |
| 12266586 | Double-sided coolable semiconductor package | Ordwin Haase, Tobias Kist | 2025-04-01 |
| 11862533 | Fluid-cooled package having shielding layer | Andreas Grassmann, Wolfram Hable, Ivan Nikitin, Achim Strass | 2024-01-02 |
| 11610830 | Power semiconductor module and method for fabricating the same | Christian Schweikert, Olaf Hohlfeld, Waldemar Jakobi | 2023-03-21 |
| 11515228 | Double sided semiconductor package | Ordwin Haase, Tobias Kist | 2022-11-29 |
| 11493538 | Sensor devices with sensor chip and busbar | Rainer Markus Schaller, Volker Strutz | 2022-11-08 |
| 11410906 | Semiconductor package and method for fabricating a semiconductor package | Bernd Betz, Stephan Bradl, Daniel Obermeier | 2022-08-09 |
| 11385301 | Sensor devices having a sensor chip and busbar | Rainer Markus Schaller, Volker Strutz | 2022-07-12 |
| 11322451 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Gottfried Beer, Magdalena Hoier, Georg Meyer-Berg | 2022-05-03 |
| 11244886 | Package cooled with cooling fluid and comprising shielding layer | Andreas Grassmann, Wolfram Hable, Ivan Nikitin, Achim Strass | 2022-02-08 |
| 11217504 | Semiconductor package with passive electrical component and method for the production thereof | Ordwin Haase, Tobias Kist | 2022-01-04 |
| 11018072 | Semiconductor package having overlapping electrically conductive regions and method for producing the same | Ordwin Haase, Tobias Kist | 2021-05-25 |
| 11004764 | Semiconductor package having symmetrically arranged power terminals and method for producing the same | Tao Hong, Tino Karczewski, Matthias Lassmann, Christian Schweikert | 2021-05-11 |
| 10985110 | Semiconductor package having an electromagnetic shielding structure and method for producing the same | Ordwin Haase, Tobias Kist | 2021-04-20 |
| 10964642 | Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane | Andre Arens, Holger Torwesten | 2021-03-30 |
| 10699976 | Semiconductor module with external power sensor | Leo Aichriedler, Christian Schweikert, Gerald Wriessnegger | 2020-06-30 |
| 10679978 | Chip module with spatially limited thermally conductive mounting body | Alexander Roth, Hans-Joachim Schulze, Hans-Joerg Timme | 2020-06-09 |
| 10615097 | Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet | Andreas Grassmann, Wolfram Hable, Angela Kessler, Ivan Nikitin, Achim Strass | 2020-04-07 |
| 10586756 | Chip carrier configured for delamination-free encapsulation and stable sintering | Alexander Roth, Andreas Grassmann, Angela Kessler | 2020-03-10 |
| 10522433 | Laminate package of chip on carrier and in cavity | Horst Theuss, Gottfried Beer | 2019-12-31 |
| 10461017 | Package with partially encapsulated cooling channel for cooling an encapsulated chip | Andreas Grassmann, Wolfram Hable, Ivan Nikitin, Achim Strass | 2019-10-29 |
| 10453771 | Package with roughened encapsulated surface for promoting adhesion | Andreas Grassmann, Kiyoung Jang, Ivan Nikitin | 2019-10-22 |
| 10418313 | Electronic module comprising a plurality of encapsulation layers and a method for producing it | Edward Fuergut, Martin Gruber | 2019-09-17 |
| 10373890 | Cooling techniques for semiconductor package | Andreas Grassmann | 2019-08-06 |
| 10304751 | Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframe | Andreas Grassmann | 2019-05-28 |