Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964642 | Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane | Juergen Hoegerl, Andre Arens | 2021-03-30 |
| 10192849 | Semiconductor modules with semiconductor dies bonded to a metal foil | Petteri Palm, Alexander Heinrich, Tobias Simbeck | 2019-01-29 |
| 9553051 | Electronic component | Petteri Palm, Manfred Schindler, Boris Plikat | 2017-01-24 |
| 9245868 | Method for manufacturing a chip package | Manfred Mengel | 2016-01-26 |
| 9214442 | Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip | Karsten Guth | 2015-12-15 |
| 8945990 | Chip package and method of forming the same | Manfred Mengel, Stefan Schmid, Soon Lock Goh, Swee Kah Lee | 2015-02-03 |
| 8709876 | Electronic device | Manfred Schneegans | 2014-04-29 |
| 8367514 | Integrated circuit with capacitor and method for the production thereof | Thomas Goebel, Johann Helneder, Heinrich Körner, Andrea Mitchell, Markus Schwerd +1 more | 2013-02-05 |
| 8263491 | Substrate with feedthrough and method for producing the same | Florian Binder, Stephan Dertinger, Barbara Hasler, Alfred Martin, Grit Sommer | 2012-09-11 |
| 8264072 | Electronic device | Manfred Schneegans | 2012-09-11 |
| 7755190 | Electronic device including a nickel-palladium alloy layer | Manfred Schneegans | 2010-07-13 |
| 7692266 | Integrated circuit with capacitor and method for the production thereof | Thomas Goebel, Johann Helneder, Heinrich Körner, Andrea Mitchell, Markus Schwerd +1 more | 2010-04-06 |