Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768035 | Electronic module and method for producing an electronic module | Guido Strotmann | 2017-09-19 |
| 9214442 | Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip | Holger Torwesten | 2015-12-15 |
| 8691624 | Die fixing method and apparatus | Alexander Ciliox, Georg Borghoff, Torsten Groening | 2014-04-08 |
| 8637379 | Device including a semiconductor chip and a carrier and fabrication method | Hannes Eder, Ivan Nikitin, Manfred Schneegans, Jens Goerlich, Alexander Heinrich | 2014-01-28 |
| 8603864 | Method of fabricating a semiconductor device | Edmund Riedl, Ivan Nikitin, Johannes Lodermeyer, Robert Bergmann | 2013-12-10 |
| 8586420 | Power semiconductor arrangement and method for producing a power semiconductor arrangement | Thilo Stolze, Guido Strotmann | 2013-11-19 |
| 8563364 | Method for producing a power semiconductor arrangement | Thilo Stolze, Guido Strotmann | 2013-10-22 |
| 8439249 | Device and method for making a semiconductor device including bonding two bonding partners | Roland Speckels, Thomas Licht | 2013-05-14 |
| 8415207 | Module including a sintered joint bonding a semiconductor chip to a copper surface | Ivan Nikitin | 2013-04-09 |
| 8253233 | Module including a sintered joint bonding a semiconductor chip to a copper surface | Ivan Nikitin | 2012-08-28 |
| 8209858 | Method for mounting electronic components on a support | Roland Speckels | 2012-07-03 |
| 8104667 | Method for connecting a component with a substrate | Aldred Kemper, Roland Speckels | 2012-01-31 |
| 7851334 | Apparatus and method for producing semiconductor modules | Roland Speckels, Hans Hartung | 2010-12-14 |
| 7793819 | Apparatus and method for connecting a component with a substrate | Alfred Kemper, Roland Speckels | 2010-09-14 |
| 7757390 | Method for production of a semiconductor component | Manfred Schneegans, Ivan Galesic | 2010-07-20 |
| 7682875 | Method for fabricating a module including a sintered joint | Ivan Nikitin | 2010-03-23 |
| 7555832 | Semiconductor chip attachment | Roland Speckels, Alfred Kemper | 2009-07-07 |