Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676933 | Arrangement and method for joining at least two joining partners | Steffen Hartmann | 2023-06-13 |
| 11081464 | Method for producing an integral join and automatic placement machine | Nicolas Heuck, Marco Marchitto | 2021-08-03 |
| 10615138 | Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods | Nicolas Heuck, Marco Marchitto | 2020-04-07 |
| 8835299 | Pre-sintered semiconductor die structure | Lars Böwer, Nicolas Heuck, Niels Oeschler | 2014-09-16 |
| 8736052 | Semiconductor device including diffusion soldered layer on sintered silver layer | Niels Oeschler, Kirill Trunov | 2014-05-27 |
| 8439249 | Device and method for making a semiconductor device including bonding two bonding partners | Thomas Licht, Karsten Guth | 2013-05-14 |
| 8209858 | Method for mounting electronic components on a support | Karsten Guth | 2012-07-03 |
| 8104667 | Method for connecting a component with a substrate | Karsten Guth, Aldred Kemper | 2012-01-31 |
| 7851334 | Apparatus and method for producing semiconductor modules | Karsten Guth, Hans Hartung | 2010-12-14 |
| 7793819 | Apparatus and method for connecting a component with a substrate | Karsten Guth, Alfred Kemper | 2010-09-14 |
| 7555832 | Semiconductor chip attachment | Karsten Guth, Alfred Kemper | 2009-07-07 |
| 7525187 | Apparatus and method for connecting components | Alfred Kemper | 2009-04-28 |