Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10600658 | Apparatus and method for bending a substrate | Andre Wedi, Guido Boenig, Christian Stahlhut | 2020-03-24 |
| 10475668 | Apparatus and method for processing a semiconductor substrate | Andre Wedi, Guido Boenig, Christian Stahlhut | 2019-11-12 |
| 10020278 | Method for positioning a semiconductor chip on a carrier and method for material-fit bonding of a semiconductor chip to a carrier | — | 2018-07-10 |
| 9741639 | Semiconductor chip, method for producing a semiconductor chip and method for soldering a semiconductor chip to a carrier | Frank Umbach, Kirill Trunov | 2017-08-22 |
| 8835299 | Pre-sintered semiconductor die structure | Roland Speckels, Lars Böwer, Nicolas Heuck | 2014-09-16 |
| 8736052 | Semiconductor device including diffusion soldered layer on sintered silver layer | Kirill Trunov, Roland Speckels | 2014-05-27 |
| 8466548 | Semiconductor device including excess solder | Reinhold Bayerer, Alexander Ciliox | 2013-06-18 |