FU

Frank Umbach

Infineon Technologies Ag: 8 patents #1,105 of 7,486Top 15%
IA Infineon Technologies Austria Ag: 4 patents #261 of 1,126Top 25%
LG Lumberg Connect Gmbh: 2 patents #6 of 16Top 40%
Overall (All Time): #336,458 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
12426331 Power semiconductor device and method of producing a power semiconductor device Damiano Cassese, Andreas Korzenietz, Holger Schulze 2025-09-23
11251266 Power semiconductor device and method of processing a power semiconductor device Philip Christoph Brandt, Manfred Pfaffenlehner, Frank Pfirsch, Francisco Javier Santos Rodriguez, Steffen Schmidt 2022-02-15
10957764 Vertical semiconductor device Franz-Josef Niedernostheide, Manfred Pfaffenlehner, Hans-Joachim Schulze, Holger Schulze, Christoph Weiss 2021-03-23
10777506 Silicon carbide semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device Frank Hille, Ravi Keshav Joshi, Michael Fugger, Oliver Humbel, Thomas Laska +6 more 2020-09-15
10475743 Semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device Frank Hille, Ravi Keshav Joshi, Michael Fugger, Oliver Humbel, Thomas Laska +6 more 2019-11-12
10224237 Semiconductor devices and methods for forming a semiconductor device Roman Roth 2019-03-05
9741639 Semiconductor chip, method for producing a semiconductor chip and method for soldering a semiconductor chip to a carrier Niels Oeschler, Kirill Trunov 2017-08-22
9419374 Connector with vibration protection 2016-08-16
9397022 Semiconductor device having a locally reinforced metallization structure Roman Roth 2016-07-19
9281360 Semiconductor device with a shielding structure Karin Buchholz, Matteo Dainese, Elmar Falck, Hans-Joachim Schulze, Gerhard Schmidt 2016-03-08
9196560 Semiconductor device having a locally reinforced metallization structure and method for manufacturing thereof Roman Roth 2015-11-24
8827753 Insertion contact for arrangement at a contact support Wolfgang Neumann, Dirk Pfaffenbach 2014-09-09
7842590 Method for manufacturing a semiconductor substrate including laser annealing Thomas Gutt, Hans Peter Felsl, Manfred Pfaffenlehner, Franz-Josef Niedernostheide, Holger Schulze 2010-11-30
7709887 Semiconductor component and method Frank Hille, Anton Mauder, Hans-Joachim Schulze, Thomas Laska, Manfred Pfaffenlehner 2010-05-04