Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315892 | Power semiconductor device load terminal | Frank Hille, Hans-Joachim Schulze | 2022-04-26 |
| 10777506 | Silicon carbide semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device | Frank Hille, Ravi Keshav Joshi, Michael Fugger, Oliver Humbel, Thomas Laska +6 more | 2020-09-15 |
| 10756035 | Semiconductor device load terminal | Wolfgang Wagner | 2020-08-25 |
| 10475743 | Semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device | Frank Hille, Ravi Keshav Joshi, Michael Fugger, Oliver Humbel, Thomas Laska +6 more | 2019-11-12 |
| 10224237 | Semiconductor devices and methods for forming a semiconductor device | Frank Umbach | 2019-03-05 |
| 10079217 | Power semiconductor device load terminal | Frank Hille, Hans-Joachim Schulze | 2018-09-18 |
| 9859272 | Semiconductor device with a reduced band gap zone | Hans-Joachim Schulze, Holger Huesken, Franz-Josef Niedernostheide, Frank Pfirsch, Christian Philipp Sandow +2 more | 2018-01-02 |
| 9773736 | Intermediate layer for copper structuring and methods of formation thereof | Ravi Keshav Joshi, Juergen Steinbrenner, Christian Fachmann, Petra Fischer | 2017-09-26 |
| 9397022 | Semiconductor device having a locally reinforced metallization structure | Frank Umbach | 2016-07-19 |
| 9196560 | Semiconductor device having a locally reinforced metallization structure and method for manufacturing thereof | Frank Umbach | 2015-11-24 |
| 8955219 | Method for fabricating a bond | Dirk Siepe | 2015-02-17 |
| 8541892 | Bonding connection between a bonding wire and a power semiconductor chip | Dirk Siepe, Thomas Gutt | 2013-09-24 |
| 7851913 | Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart | Thomas Gutt, Dirk Siepe, Thomas Laska, Michael Melzl, Matthias Stecher | 2010-12-14 |