Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12232302 | Dipped coated electronic module assembly with enhanced thermal distribution | Chee Yang Ng | 2025-02-18 |
| 12218038 | Leadframe, semiconductor package and method | Chau Fatt Chiang, Paul Armand Asentista Calo, Kok Yau Chua, Josef Hoeglauer, Khay Chwan Saw | 2025-02-04 |
| 12176222 | Semiconductor package with metal posts from structured leadframe | Chau Fatt Chiang, Thorsten Meyer, Chan Lam Cha, Wern Ken Daryl Wee, Chee Hong Lee +2 more | 2024-12-24 |
| 11791169 | Dual step laser processing of an encapsulant of a semiconductor chip package | Pei Luan Pok, Roslie Saini bin Bakar, Chau Fatt Chiang, Chee Hong Lee, Yu Shien Leong +2 more | 2023-10-17 |
| 11682644 | Semiconductor device with a heterogeneous solder joint and method for fabricating the same | Sook Woon Chan, Fong Mei Lum, Joachim Mahler, Muhammad Muhammat Sanusi | 2023-06-20 |
| 11469161 | Lead frame-based semiconductor package | Thorsten Scharf, Chan Lam Cha, Wolfgang Hetzel, Stefan Macheiner | 2022-10-11 |
| 11302613 | Double-sided cooled molded semiconductor package | Chau Fatt Chiang, Josef Maerz, Thomas Stoek, Chee Voon Tan | 2022-04-12 |
| 11289436 | Semiconductor package having a laser-activatable mold compound | Chee Hong Lee, Kok Yau Chua, Chii Shang Hong, Chee Yang Ng, Klaus Schiess | 2022-03-29 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye +4 more | 2022-03-15 |
| 11174152 | Over-under sensor packaging with sensor spaced apart from control chip | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Chee Yang Ng | 2021-11-16 |
| 11081417 | Manufacturing a package using plateable encapsulant | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Joachim Mahler +3 more | 2021-08-03 |
| 10914018 | Porous Cu on Cu surface for semiconductor packages | Norbert Pielmeier, Chin Yung Lai, Muhammad Muhammat Sanusi, Evelyn Napetschnig, Nurfarena Othman +1 more | 2021-02-09 |
| 10886199 | Molded semiconductor package with double-sided cooling | Chau Fatt Chiang, Josef Maerz, Thomas Stoek, Chee Voon Tan | 2021-01-05 |
| 10501312 | Over-under sensor packaging with sensor spaced apart from control chip | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Chee Yang Ng | 2019-12-10 |
| 10431560 | Molded semiconductor package having an optical inspection feature | Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2019-10-01 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Joachim Mahler +3 more | 2019-08-27 |
| 10304780 | Device having substrate with conductive pillars | Chau Fatt Chiang, Kok Yau Chua, Chee Yang Ng, Valentyn Solomko | 2019-05-28 |
| 10163812 | Device having substrate with conductive pillars | Chau Fatt Chiang, Kok Yau Chua, Chee Yang Ng, Valentyn Solomko | 2018-12-25 |
| 10099411 | Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips | Choon Huey Wang, Chau Fatt Chiang, Chee Hong Fang | 2018-10-16 |
| 9868632 | Molded cavity package with embedded conductive layer and enhanced sealing | Chau Fatt Chiang, Kok Yau Chua, Chee Yang Ng, Horst Theuss | 2018-01-16 |
| 9852918 | Embedding additive particles in encapsulant of electronic device | Peh Hean Teh, Jagen Krishnan, Poh Cheng Lim, Joachim Mahler, Chew Theng Tai +2 more | 2017-12-26 |
| 9806043 | Method of manufacturing molded semiconductor packages having an optical inspection feature | Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2017-10-31 |
| 9540539 | Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device | Joachim Mahler, Chew Theng Tai, Yik Yee Tan, Soon Lock Goh, Poh Cheng Lim +2 more | 2017-01-10 |
| 9475691 | Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device | Kok Yau Chua, Sook Woon Chan, Chau Fatt Chiang, Stefan Martens, Matthias Steiert +3 more | 2016-10-25 |
| 9287238 | Leadless semiconductor package with optical inspection feature | Soon Lock Goh | 2016-03-15 |