Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431560 | Molded semiconductor package having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2019-10-01 |
| 9806043 | Method of manufacturing molded semiconductor packages having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2017-10-31 |