Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682644 | Semiconductor device with a heterogeneous solder joint and method for fabricating the same | Swee Kah Lee, Sook Woon Chan, Joachim Mahler, Muhammad Muhammat Sanusi | 2023-06-20 |
| 10431560 | Molded semiconductor package having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Muhammad Muhammat Sanusi +1 more | 2019-10-01 |
| 9806043 | Method of manufacturing molded semiconductor packages having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Muhammad Muhammat Sanusi +1 more | 2017-10-31 |