Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081417 | Manufacturing a package using plateable encapsulant | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2021-08-03 |
| 10490470 | Semiconductor package and method for fabricating a semiconductor package | Hock Heng Chong, Sook Woon Chan, Chau Fatt Chiang, Khar Foong Chung, Chee Hong Fang +4 more | 2019-11-26 |
| 10431560 | Molded semiconductor package having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2019-10-01 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2019-08-27 |
| 9806043 | Method of manufacturing molded semiconductor packages having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2017-10-31 |
| 9475691 | Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device | Kok Yau Chua, Sook Woon Chan, Chau Fatt Chiang, Stefan Martens, Matthias Steiert +3 more | 2016-10-25 |
| 9219025 | Molded flip-clip semiconductor package | Swee Kah Lee, Chee Hong Fang | 2015-12-22 |
| 8951841 | Clip frame semiconductor packages and methods of formation thereof | Melissa Mei Ching Ng, Peng-Soon Lim | 2015-02-10 |