Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10639833 | Molding system with movable mold tool | Chau Fatt Chiang | 2020-05-05 |
| 10490470 | Semiconductor package and method for fabricating a semiconductor package | Hock Heng Chong, Sook Woon Chan, Chau Fatt Chiang, Chee Hong Fang, Muhammat Sanusi Muhammad +4 more | 2019-11-26 |