Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682644 | Semiconductor device with a heterogeneous solder joint and method for fabricating the same | Swee Kah Lee, Fong Mei Lum, Joachim Mahler, Muhammad Muhammat Sanusi | 2023-06-20 |
| 11174152 | Over-under sensor packaging with sensor spaced apart from control chip | Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng | 2021-11-16 |
| 11081417 | Manufacturing a package using plateable encapsulant | Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee, Joachim Mahler +3 more | 2021-08-03 |
| 10501312 | Over-under sensor packaging with sensor spaced apart from control chip | Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng | 2019-12-10 |
| 10490470 | Semiconductor package and method for fabricating a semiconductor package | Hock Heng Chong, Chau Fatt Chiang, Khar Foong Chung, Chee Hong Fang, Muhammat Sanusi Muhammad +4 more | 2019-11-26 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee, Joachim Mahler +3 more | 2019-08-27 |
| 9475691 | Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device | Kok Yau Chua, Chau Fatt Chiang, Stefan Martens, Matthias Steiert, Kian Hong Yeo +3 more | 2016-10-25 |