Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682644 | Semiconductor device with a heterogeneous solder joint and method for fabricating the same | Swee Kah Lee, Sook Woon Chan, Fong Mei Lum, Joachim Mahler | 2023-06-20 |
| 10914018 | Porous Cu on Cu surface for semiconductor packages | Norbert Pielmeier, Chin Yung Lai, Swee Kah Lee, Evelyn Napetschnig, Nurfarena Othman +1 more | 2021-02-09 |
| 10431560 | Molded semiconductor package having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum +1 more | 2019-10-01 |
| 9806043 | Method of manufacturing molded semiconductor packages having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum +1 more | 2017-10-31 |