Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10914018 | Porous Cu on Cu surface for semiconductor packages | Chin Yung Lai, Swee Kah Lee, Muhammad Muhammat Sanusi, Evelyn Napetschnig, Nurfarena Othman +1 more | 2021-02-09 |